ET7014 APPLICATION OF MEMS TECHNOLOGY

ET7014       APPLICATION OF MEMS TECHNOLOGY

UNIT I  MEMS:MICRO-FABRICATION, MATERIALS AND ELECTRO-MECHANICAL CONEPTS

Overview of micro fabrication – Silicon and other material based fabrication processes – Concepts: Conductivity of semiconductors-Crystal planes and orientation-stress and strainflexural beam bending analysis-torsional deflections-Intrinsic stress- resonant frequency and quality factor. 

UNIT II      ELECTROSTATIC SENSORS AND ACTUATION

Principle, material, design and fabrication of parallel plate capacitors as electrostatic sensors and actuators-Applications  

UNIT III     THERMAL SENSING AND ACTUATION

Principle, material, design and fabrication of thermal couples, thermal bimorph sensors, thermal resistor sensors-Applications.  

UNIT IV     PIEZOELECTRIC SENSING AND ACTUATION

Piezoelectric effect-cantilever piezo electric actuator model-properties of piezoelectric materials-Applications

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UNIT V     CASE STUDIES

Piezoresistive sensors, Magnetic actuation, Micro fluidics applications, Medical applications, Optical MEMS.-NEMS Devices 

REFERENCES 

1. Chang Liu, “Foundations of MEMS”, Pearson International Edition, 2006. 

2. Marc Madou , “Fundamentals of microfabrication”,CRC Press, 1997.

3. Boston , “Micromachined Transducers Sourcebook”,WCB McGraw Hill, 1998. 

4. M.H.Bao “Micromechanical transducers :Pressure sensors, accelerometers and     gyroscopes”, Elsevier, Newyork, 2000. 

5. P. RaiChoudry“ MEMS and MOEMS Technology and Applications”, PHI, 2012. 

6. Stephen D. Senturia, “ Microsystem Design”, Springer International Edition, 2011.